Geode™ G2 CO2 via Drilling System for HDI PCBs
Geode™ G2 CO2 via Drilling System for HDI PCBs
Next Generation of the Most Advanced CO2 Laser Drill for HDI and mSap
- Increased productivity: ~15% throughput improvement over Geode™ Laser Drill
- Improved accuracy: Accuracy improved to M+4s
- Advanced Calibration & Beam Metrology See All Features
Features
Increased Factory Productivity and Yield with Higher Throughput and Improved Accuracy
The Geode™ G2 Laser Drilling System is the next generation of ESIs most advanced CO2 solution for drilling HDI microvias. Offering higher productivity and greater flexibility in processing both PCB and ICP materials. Combining a powerful CO2 laser with innovative HyperSonix™ technology for advanced energy control capabilities delivering breakthrough productivity, precision, and yield.
Advanced Acceledrill™- Increase Flexibility and Via Quality
Outpace your competition by increasing throughput by drilling multiple via diameters in a single pass. Geode™ will enable you to process an extensive dynamic range of via size without changing the spot size. Provinding best-in-class recipe development flexibility for new developing materials.
HyperSonix™ Innovation- Higher Throughput & Precise Power Control
Your traditional Rigid PCB via drilling system may need several pulses to ablate copper & material, reducing your production yield. Increase your throughput and accuracy with Geode’s pulse chopping capabilities to ablate copper and material with minimal pulses.
RTPC - Monitor & Control in Real Time
Discover how you can increase stability and via quality with the industry’s only real-time power control. Geode™ will enable you to actively manage power fluctuation to ensure higher productivity in your Rigid PCB processing.
LiteDesign™
Footprint - Compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.
- 72% lighter than competitors
- Up to 42% more drilling capacity
- Up to 65% lower power consumption
UpTime™
Easy-access design improves serviceability, decreasing maintenance and service downtime.
VDC™ Accuracy
Via density compensation improves via diameter stability, accuracy and throughput.
Materials
- Glass-woven Reinforced Epoxy Resin (FR4)
- Bismaleimide-Triazine Resin (BT)
- Ajinomoto Build-Up Film® (ABF)
- Resin-Coated-Copper (RCC)
- Teflon (PTFE)
- Liquid Crystal Polymer (LCP)
- EMC
- Ceramics
- Glass
