RedStone™ Flex PCB Laser Processing System
RedStone™ Flex PCB Laser Processing System
Reliability. Accuracy. Ease-of-use. All at a low cost of ownership.
- Economincal flex-pcb system with broad capabilities
- Nanosecond UV laser
- Stage and galvo positioning at up to 500 mm/s See All Features
Features
Easily address most flex and rigid-flex PCB processing needs
RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.
Accuracy
Don’t sacrifice accuracy to meet your cost of ownership targets. The RedStone system benefits from the same accurate frame, precision engineering, and alignment and scaling mechanisms at ESI’s top-tier flex drilling systems.
Depaneling
RedStone utilizes a highrepetition-rate / high-averagepower laser that is well suited to applications such as through hole drilling and through cutting. The laser minimizes heat affected zones to deliver higher quality cutting with minimal risk of degradation to the material.
High Uptime
Rest assured that your RedStone system will stay productive with high uptime. RedStone shares over 90% of components in common with the flagship ESI 5335™ in high-volume 24/7 production at the world’s top 10 flex circuit manufacturers.
Ideal for Large Process Window Applications
RedStone is the ideal system for processing applications that can be developed with large process windows. Large process window applications examples include through-cut routing, through via applications, larger blind vias on robust flex materials and removing easily-ablated materials from a durable substrate. Applications such as these can best utilize RedStone’s high accuracy, high throughput capabilities while ensuring high process yield.
Engineered for production-oriented flex PCB laser processing
- ESI-patented compound beam positioning technology
- Automated vision system for alignment and scaling compensation
- Easy-to-use Windows 10 interface
- Multi-language operator user interface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
Processes
- Through via drilling (THV)
- Flex and interconnect processing
- Blind via drilling (BHV)
- Routing
- Coverlay routing
Materials
- Polyimide (PI)
- Liquid Crystal Polymer (LCP)
- Copper-clad Polyimide Laminates (CCL)
- Adhesiveless
- With Adhesive
- Glass-reinforced laminates (FR4, BT, RT Duroid)
- Coverlay (Polyimide with Flexible Adhesive)
Resources
Application Notes
Flex PCB Processing Process Development Tips and Tricks for Effective Flexible Circuit Laser Processes How to Get Your New Flex System Installed and Processing Those First Runs Getting Your Facilities Ready for the Introduction of Laser Processing How to Calculate and Optimize Total System Cost of Ownership and Cost per Panel Manufacturing Flow and Considerations in Adopting Laser Processing Capabilities
Literature
Flex Circuit Laser Processing eBook(4.5 MB, PDF) ESI Laser Drill Systems(5.8 MB, PDF)
Data Sheets
Redstone Data Sheet(417.4 kB, PDF)
White Papers
Stepping Up to Laser Processing for Flex PCB(807.5 kB, PDF) Keeping Current to Stay Competitive in Flex PCB Processing(1.4 MB, PDF)
